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7:55 |
Opening Remarks |
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128.1 |
8:00 |
THE IMPACT of FLIP-CHIP PACKAGING on RF MONOLITHIC INDUCTORS "M. N. Abdulla, Q. Chen, Intel Corporation, USA" |
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128.2 |
8:20 |
Modeling of Planar Inductors in IC's At X-Band "K. Idstein, R. Rojas, The Ohio State University, G. Creech, AFRL/SNDM , USA" |
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128.3 |
8:40 |
A New Class of Interdigital Capacitors for Planar Integrated Circuits "G. Bit-Babik, Motorola, USA, D. Caratelli, R. Cicchetti, University of Rome ""La Sapienza"", Italy, A. Faraone, Motorola, USA" |
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128.4 |
9:00 |
THE EFFECT of PACKAGE CAVITY on the WIREBOND HIGH FREQUENCY PERFORMANCE "M. N. Abdulla, Q. Chen, Intel Corporation, USA, X. Zeng, Intel China LTD, China" |
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128.5 |
9:20 |
Signal Integrity Issues for Package Level Discontinuities and RF Chip-Package Interconnects using FDTD Analysis and Equivalent Circuit Modeling "J. McFiggins, M. Bhagat, J. Venkataraman, Rochester Institute of Tech., USA" |
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128.6 |
9:40 |
Mitigation of PCB Radiation Through Novel Mesh Fencing Techniques "X. Wu, O. M. Ramahi, University of Maryland, USA" |
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128.7 |
10:00 |
Junction Circuit using NRD Guide / Vertical Strip Line Trans-former At 60GHz "F. Kuroki, Kure Nat'l Coll of Tech, T. Yoneyama, Tohoku Inst of Tech, M. Kimura, Kure Nat'l Coll of Tech, Japan" |
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128.8 |
10:20 |
FDTD Modeling of 3D Metal-LTCC Structures for RF(MM)ICs "X. Dong, B. Guo, W. Yin, Y. Gan, Temasek Laboratories, Singapore" |
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128.9 |
10:40 |
Comparative Studies on the Capacitive Coupling in 3D Interconnects Embedded in LTCCs "W. Yin, B. Guo, X. Dong, Y. Gan, Temasek Laboratories, Singapore" |
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128.10 |
11:00 |
Scattering Parameters of Magnetostatic Surface-wave Transducers: Theory and Experiment "M. J. Freire, R. Marques, F. Medina, University of Seville, Spain" |
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128.11 |
11:20 |
A Photonic Bandgap Antenna Reflector for PCS Applications "D. Kim, Korea University, Korea" |
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128.12 |
11:40 |
Model Establishment and Crosstalk Analysis of the Common-Leg Multiconductor Transmission Line "Chi-Fang Huang and Yun-Chih Chao, Tatung University, Taiwan" |